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What the new leak reveals
A fresh leak detailing MediaTek’s upcoming Dimensity 9500 chipset has surfaced ahead of the expected September launch, outlining a broad set of hardware upgrades that go beyond raw CPU and GPU figures. Sourced from reliable tipster Digital Chat Station, the leak sketches a flagship-class SoC built on TSMC’s N3P (3nm) node and positioned to debut in late-September devices such as the vivo X300 series, with Oppo’s Find X9 rumored to follow in October.
Key technical highlights
The Dimensity 9500 reportedly adopts an all-high-performance core layout optimized for peak single-thread and multi-thread workloads. The CPU cluster includes one Cortex-X930 at 4.21GHz, three additional Cortex-X930 cores at 3.5GHz, and four Cortex-A730 efficiency cores clocked at 2.7GHz. On the graphics side, MediaTek is said to pair the chip with a Mali-G1 Ultra MC12 GPU built on a new microarchitecture aimed at better ray-tracing performance and improved power efficiency — the leak suggests a GPU clock in the region of ~1GHz.
Memory, cache and storage
The SoC supports 4-channel LPDDR5X at up to 10667Mbps and implements 4-lane UFS 4.1 storage. Cache allowances include a sizeable 16MB L3 cache plus a 10MB system-level cache (SLC), which should help reduce memory latency in demanding apps and games.
AI, imaging and instruction support
One of the headline upgrades is the next-generation NPU 9.0, which the leak claims approaches ~100 TOPS—an important metric for on-device AI workloads like real-time image processing, voice assistants and AR. The chip reportedly adds support for the SME instruction set to broaden computational and vector capabilities. For photography, the Dimensity 9500 may be compatible with Vivo’s V3+ ISP variant, though this imaging stack could be limited to Vivo-branded phones.
Advantages, comparisons and market relevance
Compared with previous MediaTek flagships, the 9500 emphasizes higher single-thread clocks and expanded AI throughput, aiming to close the gap with Qualcomm’s next-gen Snapdragon parts. The combination of TSMC N3P efficiency, larger caches, and LPDDR5X/UFS 4.1 support positions the chip as a competitive choice for premium Android devices — offering improved gaming, photography and AI experiences while targeting lower power consumption.
Use cases and target devices
Expect the Dimensity 9500 to power flagship-level smartphones focused on mobile gaming, computational photography and AI-driven features. Early adopters will likely be vivo’s X300 lineup, with Oppo’s Find X9 series arriving later. The timing — reportedly September 22nd launch — could let MediaTek briefly go head-to-head with Qualcomm’s next releases, shaping the late-year flagship market.
Bottom line
The leaked Dimensity 9500 specification sheet points to a well-rounded flagship SoC: aggressive CPU clocks, a redesigned Mali-G1 Ultra GPU for better ray tracing and efficiency, robust NPU performance, and modern memory/storage support. If the claims hold, MediaTek could deliver a strong contender for high-end Android phones in late 2025.
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