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Engineers in China and the United States have unveiled a compact 6G prototype chip capable of delivering sustained data rates above 100 gigabits per second (Gbps). That throughput is roughly ten times higher than the theoretical peak of 5G and orders of magnitude faster than today’s average mobile connections. Developed by teams at Peking University, the City University of Hong Kong and the University of California, Santa Barbara, the device demonstrates a practical approach to the ultrabroadband radio frequencies expected to underpin future 6G networks.
Key technical features
Size and spectrum coverage
The chip measures only 11 millimeters by 1.7 millimeters yet spans an ultrabroadband frequency range from 0.5 GHz to 115 GHz. Covering that sweep requires the equivalent of nine radio bands, a task usually handled by many different components. The integration of these bands into a single, compact package is a significant engineering achievement for wireless hardware.
Electro-optic conversion and generation
The prototype relies on an electro-optic modulator to translate radio-frequency signals into optical signals, which can be processed with extremely low loss and high fidelity. To generate radio frequencies across the ultra-wideband, the design pairs optical techniques with optoelectronic oscillators. This combination reduces complexity while enabling high spectral efficiency and wide instantaneous bandwidth.
How it compares to 5G
While 5G’s theoretical peak is often cited near 10 Gbps, real-world consumer speeds are far lower — U.S. mobile providers typically report averages between 150 and 300 megabits per second (Mbps). The new 6G chip’s 100+ Gbps capability would enable new classes of applications and dramatically reduce latency for data-heavy tasks.
Advantages and performance benefits
High throughput and spectral efficiency
The integrated ultrabroadband approach boosts raw throughput and improves spectral utilization by enabling seamless operation across multiple frequency bands. The electro-optic architecture also helps mitigate RF losses and interference, which can translate into higher effective user data rates in dense environments.
Compact form factor
Shrinking the RF and photonic chain into an 11 mm × 1.7 mm package lowers power and footprint penalties, making the technology promising for base stations, small cells, and potentially advanced user devices.
Use cases and practical applications
The bandwidth and low-latency potential of this chipset support a range of near-term and future use cases:
- Ultra-high-definition (UHD) and immersive media streaming (4K/8K, VR/AR) with near-instant downloads and near-zero buffering.
- Distributed AI and edge computing workflows that require fast, high-volume model updates and real-time inference.
- Industrial automation, remote surgery, and autonomous vehicle coordination where both throughput and deterministic latency matter.
- Backhaul and fronthaul links for dense urban networks needing multi-hundred-gigabit links.
Market relevance and roadmap
6G deployments are not expected until the 2030s, but components like this chip are critical for building the ecosystem and standards that will follow. Integrating optical and RF techniques into compact modules addresses known challenges for multi-band operation and could accelerate vendor and carrier confidence in 6G hardware. The research team published their findings in Nature, signaling peer-reviewed validation and inviting further industry collaboration.
Limitations and next steps
Real-world adoption requires systems-level development: radios, antennas, network protocols, spectrum allocation, and infrastructure investment must all evolve. Power consumption, thermal management, manufacturing yield and cost will determine whether the prototype can scale into commercial silicon. Nevertheless, the demonstration is a meaningful step toward ultrabroadband 6G radios.
Conclusion
The ultrabroadband 6G prototype combines photonic and RF innovations to exceed 100 Gbps in a tiny package, offering a glimpse of the high-throughput future of wireless communications. As carriers and hardware vendors lay the groundwork for 6G, such chips could become key building blocks for next-generation networks that support UHD streaming, pervasive AI, and new industrial use cases.
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