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Apple’s next Vision Pro may pack a custom R2 coprocessor
Apple is reportedly preparing a successor to the Vision Pro's R1 co-processor: the in-house R2 chip. Built on TSMC's cutting-edge 2nm process, the R2 is expected to take over tasks that the original R1 currently handles, including sensor fusion, camera input processing, and the low-latency tracking of eyes, hands, and head position.
What the R2 could mean for XR performance
Because the R2 will likely be fabricated on a smaller 2nm node, industry observers expect gains in both performance and power efficiency. In practical terms, that could translate to:
- Smoother mixed-reality rendering and faster sensor processing
- Lower system latency for eye and gesture tracking
- Improved battery life or reduced thermal load in a compact headset
These are incremental but important advantages for AR and XR headsets where sensor responsiveness is critical to comfort and immersion.
How this fits into Apple’s broader silicon roadmap
The R2 is not the only Apple-designed part moving to 2nm. Rumors indicate the iPhone 18 could pair an A20 application processor on 2nm with Apple’s own C2 modem. If accurate, this shows Apple continuing to vertically integrate key chips across product lines — from handsets to headsets — to optimize performance, power, and user experience.
Timing remains uncertain. An updated Vision Pro model is rumored for this year, while a definitive successor may arrive in 2027. It is not yet clear whether the R2 will debut in this year’s refresh or wait until the full next-generation headset.
In short: R2 is likely a focused upgrade for sensor and input processing — faster, more efficient, and tuned for immersive experiences.
For readers tracking visionOS, AR, and XR hardware, the arrival of an Apple-built R2 on TSMC's 2nm node would be a notable step in the platform's evolution.
Source: gsmarena
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